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Process Engineer - Backend
Process Engineer – Backend (100-130K)
We are seeking a Process Engineer – Backend to work for a High-Tech Manufacturer in the Syracuse, NY area.
What’s in it for you?
- Competitive Salary, Annual Bonus, Medical / Dental Benefits, Unlimited PTO, Restricted Stock Options and much more.
- Outstanding Career Opportunity to Join a Start-Up Fab with over 100M in assets.
Key Duties and Responsibilities:
- Develop backend wafer processes including wafer thinning, ohmic contacts and low kerf dicing.
- You will work closely with product engineering, assembly, and device, teams, and with outsource service providers, to develop and qualify manufacturing processes
- Development of novel ohmic contact metallurgies
- Design and implementation of wafer handling fixturing and tools for thin (100 um) GaN wafers
- Optimization of high-volume laser dicing processes
- Qualification of tools and materials for back grinding and polishing of GaN wafers
- Qualification and project management of outsource service providers
- Documentation and traceability of critical manufacturing processes
- Work closely with Device and Wafer Fab Engineering to achieve
- Work with Assembly Engineering on package development
Education and Experience:
- Minimum BS in Electrical Engineering, Chemical Engineering, Materials Science, or Physics. MS/PhD is desired.
- The ideal candidate will have 5+ years of semiconductor process experience preferably with wide bandgap semiconductors, e.g. GaN, SiC.
- Excellent oral and written communications skills.
For immediate consideration submit your resume to: email@example.com
- Start Date:
- Pay Rate:
- $100,000 - 130,000/year
- Syracuse, NY 13212
- Job Type:
- Direct Hire
- Job ID: